-
6
Hardness (Mohs)
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500℃
Maximum Printing Temperature
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330W/m·k
Thermal Conductivity
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16.7μm/m·℃
Expansion Coefficient
Adaptation Models
1100-PS-PC
1200-PS-PC
1110-PH-PC
175:Φ0.25/Φ0.30/Φ0.35/Φ0.40/Φ0.50/Φ0.60/Φ0.80/Φ1.00
300:Φ0.25/Φ0.30/Φ0.35/Φ0.40/Φ0.50/Φ0.60/Φ0.80/Φ1.00
Performance Analysis
Temperature resistance up to 500℃, the best choice for special engineering plastics such as PEEK.High thermal performance keeps an even temperature of nozzle tip during printing, thus guaranteeing a stable extrusion; Meanwhile, further improves printing speed without sacrificing the quality.Special processing technology and post-treatment make the nozzle without burr at the edge of tip and debris in the hole.Inner hole roughness lower than Ra0.4 and the whole nozzle nickel plated, enhanced higher smoothness and less adhesion.Superior quality copper alloy with high strength and high thermal conductivity ensures the stability of performance.
Applicable Filament
Working well for high temperature applications, printing with materials such as PEEK, PEKK, PEI, PSU, PPSU and etc.
Product Features
-
φ0.25
Min. Orifice Diameter
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±0.01mm
Tolerance
-
≤Ra0.4μm
Inner Hole Roughness
-
≤0.02mm
Concentricity